CHGBearing Thin-Section Bearings: Precision Motion Core for Semiconductor Wafer Equipment
CHGBearing Technology Co., Ltd. specializes in R&D and manufacturing of high-performance thin-section bearings, delivering high-precision, ultra-reliable motion solutions for semiconductor wafer handling systems, dicing equipment, and robotic manipulators.
I. Core Technological Advantages
Precision Manufacturing Capabilities
Rotation accuracy strictly controlled at ±0.01mm (ISO P2 standard compliant)
Optimized equal-section design (Section height/OD ratio <1.25) ensuring thermal stability (-55°C to 350°C)
Critical processes executed in Class 1,000 cleanrooms with final assembly in Class 100,000 environments
Material & Process Innovations
Silicon nitride ceramic balls + specialty stainless steel combination minimizing particulate generation
PEEK self-lubricating cages eliminating lubrication contamination and electrostatic risks
Extreme Environment Adaptability
Validated across wide temperature ranges (-55°C to 350°C)
Advanced sealing solutions ensuring reliable operation in cleanroom environments
II. Semiconductor Application Validation
▌ Wafer Handling Systems
Four-point contact thin-section bearings:
→ 40% increased axial load capacity enabling stable high-speed transfer
→ Non-contact sealing validated for long-term particulate control
▌ Robotic Manipulator Joints
High-precision angular contact bearings:
→ Achieving 0.005° repositioning accuracy
→ 35% weight reduction vs conventional designs
→ Deployed across multiple semiconductor equipment manufacturers
▌ Wafer Dicing Equipment
Cross roller bearings:
→ Effective distribution of cutting impact loads
→ Ceramic coating technology enhancing corrosion resistance
III. Core Capability Framework
| Capability | Technical Performance | Customer Value |
|---|---|---|
| Precision Machining | Full-process CNC grinding | Guaranteed motion smoothness |
| Clean Manufacturing | Class 1K cleanrooms + assembly control | Meeting wafer contamination requirements |
| Custom Development | Rapid solution design response | Accelerating equipment development |
| Reliability Validation | Comprehensive life testing systems | Ensuring operational stability |
IV. Continuous Innovation
High-temperature solutions: Mature 350°C operational capabilities
Material advancement: Ceramic components enhancing wear resistance
Process optimization: Duplex bearing designs reducing alignment errors
Active participation in industry technology exchanges
Through our proprietary precision manufacturing system – featuring end-to-end control from material processing to superfinishing – CHGBearing provides high-reliability bearing solutions for semiconductor equipment. Our thin-section bearings are successfully implemented in 12 equipment manufacturers' wafer processing systems, delivering critical motion accuracy for advanced semiconductor manufacturing.
